Embedded Computing

RM-F6 series

Wide Temperature SMARC Module w/ NXP i.MX6 Cortex-A9 800MHz SoC

SMARC Small Form Factor (82mm x 50mm) SoMi.MX6 automotive grade Dual/Solo core 800MHz1080p hardware encode/decodeOpenGL ES 2.0 and OpenVG 1.1 hardware accelerators1GB DDR3L, 4GB eMMC on board10/100/1000 Mbit EthernetSupports 24-bit parallel LCD, LVDS & HDMISupports Linux 3.0, Android 4.3Wide operating temperature (-40°C ~ 85°C)

The RM-F6XX1-SMC is a SMARC module powered by the high performance Freescale i.MX6 processor running 800 MHz. It supports an image capture interface for MIPI cameras, 18/24-bit parallel LCD, LVDS and HDMI interface, as well as a full-HD 1080p hardware video codec engine. It is best suited for mobile and HMI systems, in addition to applications in the multimedia, automotive, medical and consumer markets.


RM-F6XX1-SMC was designed based on SMARC ("Smart Mobility ARChitecture"), a versatile small form factor for computer modules with 82mm x 50mm size that targets applications requiring low power and high scalability. RM-F6XX1-SMC is integrated with 1GB DDR and 4GB eMMC memory and supports Linux 3.0 and Android 4.3.


The SMARC-EVK1 development kit that also includes a cable kit can be purchased for quick start reference to develop a custom carrier board. The carrier board, RP-102-SMC (3.3V IO voltage), features a broad range of interface options for design development flexibility that include GbE, audio, USB OTG, USB and COM ports on the same side of the board, as well as 2x CAN, 8x GIO, Mini PCIe, Micro SD and SIM sockets. IBASE also provides the carrier board schematics, review service, test reports, and FAE debug service during the engineering development phase.


Video Codec Multi-format HD1080 video Decode and Encode
CAN Bus 2x CAN2.0B
LAN AR8031 GbE LAN PHY on board
OS Support Ubuntu Linux 11.10 (kernel 3.0)/ Android 4.3
Form Factor SMARC™
I²C 3x I²C / 4x I²C (F6SO1 Only)
Dimensions 82mm x 50mm (3.2” x 2”)
USB 2x USB 2.0 Host & 1x USB OTG Interface
CPU NXP i.MX6 Dual/ Solo Cortex-A9
Up to 800Mhz with 512KB L2 cache
Relative Humidity Humidity: 0 % to 90 % RH at 60° C (non-condensing)
Shock: Non-Operating: 1G, 15 mins (x-, y-, z-axis)
Vibration : Non-operating: 3 Hz to 500 Hz, 15 mins
Audio I²S, S/PDIF
Image Capture Interface CSI Interface for MIPI camera (2 lanes)
System Memory I-grade 1GB DDR3L on Board (4GB maximum)
Operating Temperature -40°C to +85°C (*need heat-sink solution)
Serial 4x UART, 2x SPI Interface
Certification CE/ FCC Class A
Media Interface 2x High-speed eMMC/SDIO (eMMC 8-bit, SDIO 4-bit)
SATA 1x SATA 2.0 (F6DU1 Only)
Display Supports 18/24-bit parallel LCD & LVDS Interface
(Up to 1920 x 1200/Dual; 1366 x 768/Solo)
Supports HDMI V1.4 Interface (1920 x 1080)
PCI-E 1x PCIe(x1) interface
RM-F6DU1-SMC RISC System on Module, 82mm x 50mm, SMARC small form factor with onboard NXP i.MX6 Dual 800MHz CPU, 1GB DDR3, 4GB eMMC, -40°C~85°C operating temperature
RM-F6SO1-SMC RISC System on Module, 82mm x 50mm, SMARC small form factor with onboard NXP i.MX6 Solo 800MHz CPU, 1GB DDR3, 4GB eMMC, -40°C~85°C operating temperature
F6DU1-HSD Heat Spreader for F6DU1
F6SO1-HSD Heat Spreader for F6SO1
F6Sxx-HSK Heat sink for F6DU1-HSD an F6SO1-HSD