RISC Platform

RM-QCS6490-S

Wide-Temperature SOM Module with Qualcomm QCS6490 Processor

  • SOM (System on Module) is integrated with Qualcomm® QCS6490 SoC
  • Video: 4K@60FPS video decoding; 4K@30FPS video encoding
  • AI Performance: 12.5 TOPS
  • Peripheral Interfaces, including GPIO, UART, I2 C, I3 C, SPI, DSI, USB 3.1, and PCI-E
  • Long-term supply with Qualcomm solution
  • Wide-range operating temperature (-25°C~75°C)
  • NEW
  • Wide Temperature
Form Factor SOM Module (System-on-Module)
Processor Qualcomm® QCS6490
Qualcomm® Kryo™ CPU 670
Qualcomm® Adreno™ GPU 642L, Adreno 633 VPU, Adreno DPU 1075
Qualcomm® Compute Hexagon™ DSP with dual HVX, Hexagon Co-processor (Hexagon CP) 2.0 and Hexagon Tensor Accelerator
Qualcomm® Spectra™ 570L image processing
System Memory 6GB
Flash Memory 128GB
Display 1x MIPI-DSI 4-lane; FHD+ (1080x2520) 8L@144FPS; 4K@60FPS display support over DisplayPort
Video Codec 4K@30FPS for H.264/H.265
4K@60FPS for H.264/H.265/VP9
Graphics N/A
Audio Interface N/A
LAN N/A
USB 1x USB 3.1 with DP, 1x USB2.0, 1x PCI-E Gen3 2-lane, 2x SoundWire, 1x SDC for SD card, 3x DMIC Interfaces, GPIOs, QUPs (UART/I2C/SPI)
Image Capture Interface N/A
Serial Interface N/A
Media Interface N/A
PCI-E N/A
SATA N/A
GPIO N/A
I²C N/A
Others Camera Interfaces: 5x 4-lane MIPI CSI D-PHY (2x of them are compatible with 3-trio MIPI CSI C-PHY for cameras up to 48M)
Voltage: 3.4V~4.5V, Typ. 3.8V
Form Factor: LGA
CAN Bus N/A
Dimensions 36mm x 49mm (1.4” x 1.9”)
Environment Humidity: 0 % to 90 % RH at 60° C (non-condensing)
Shock: Non-Operating: 1G, 15 mins (x-, y-, z-axis)
Vibration: Non-operating: 3 Hz to 500 Hz, 15 mins
Operating Temperature -25°C ~ +75°C #
OS Support Android 12/13, Ubuntu
Certification CE/ FCC Class-A
RM-QCS6490-S Industrial-grade SOM (System-on-Module), Qualcomm® QCS6490, 6GB LPDDR4, 128GB eMMC
DATASHEETS RM-QCS6490-S

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